Features
- Automotive Qualified (AEC-Q101) and PPAP capable
- Top side cooling (TSC) for improved thermal performance
- Surface mount package for automated assembly
- Kelvin source pin for fast gate control
Part Number | E3M0075120U2 Coming Soon | E3M0075120U2-TR |
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Order Status | Coming Soon | Coming Soon |
Buy Online | ||
Request Sample | ||
Package | TSC (U2) | TSC (U2) T&R |
Container Type | Tape & Reel | |
Container Qty. | 800 | |
Standard Packing Qty. | 800 | |
Minimum Order Qty. | 800 |
California Prop 65 | Learn More |
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ECCN | EAR99 |
Moisture Sensitivity Level | MSL 1 |
Soldering & Handling | |
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Packing & Shipping |
Document Type | Document Name | Last Updated |
---|---|---|
Application Notes | 02/2025 | |
Application Notes | 09/2024 | |
Application Notes | 07/2024 | |
Application Notes | 01/2024 | |
Application Notes | 12/2023 | |
Application Notes | 11/2023 | |
Application Notes | 01/2023 | |
Application Notes | 09/2022 | |
Product Catalog | 01/2025 | |
Sales Sheets & Flyers | 07/2022 | |
Sales Terms | 04/2025 | |
Sales Terms | Power Product Packing & Shipping Reference Guide This document details the production packaging details including container type, quantity, MOQ, and dimensions as well as the moisture sensitivity level (MSL) for discrete SiC Schottky Diodes and MOSFETs.
| 03/2025 |